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https://doi.org/10.1149/1.2357085
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Cite Journal: Electrochemical Society Transactions |  Publication Date: Oct 20, 2006 |
 License type: iop-standard |
Affiliation: X-Fab (Germany)
This paper will give an overview of the use of wafer bonding technologies, in particular, semiconductor direct bonding, glass frit bonding and anodic bonding, in the manufacture of MEMS devices. The potential of these processes is illustrated, as well as the challenges of integrating the bonding process into industrial processing.
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