Wafer- and piece-wise Si tip transfer technologies for applications in scanning probe microscopy

Abstract

A novel tip transfer technology is proposed for applications in scanning probe microscopy (SPM). The technology is based on the concept of fabricating tips on an independent wafer and transferring them onto the target wafer. The transfer is also feasible on a full 4-in wafer scale. This is especially attractive for postprocessing CMOS wafers, e.g., for atomic force microscopy chips with integrated electronics. A yield of more than 90% has been achieved in a first experimental set-up. Moreover, a piece-wise tip transfer onto a free-standing cantilever is also shown. During this transfer, the tip is completely encapsulated in a resist post and, hence, protected against mechanical impact. This technology can be applied not only to SPM probe fabrication but also to create a new kind of MEMS device.