Volume Testing Microwave Devices

Abstract

The proliferation of emerging RF standards that increase transmission data rates for many different applications is upon us. The volume of RFIC devices needed to meet demands for these applications is enormous. In order to keep up with this volume, ATE suppliers are required to improve the performance and increase the density of baseband instrumentation. Integrating compliant signal generation software and bench-top measurement software into ATE systems is reducing the time it takes to get these devices into production and is helping test engineers keep pace with ever-evolving standards. Current and future trends in integration are combing RF, digital baseband cores and power management functions into a single package. Device fabrication processes dictate that each function (RF, digital cores, power management) are on separate silicon die. These dies are then packaged together to form a System in a Package (SiP). Methods of fabricating the whole system on a single die is called System on a Chip (SoC). ATE systems available today not only cover the RF front end test requirements, but also complete SiP/SoC test plans. The RF, baseband, digital, and dc instruments that are used to test RF front ends also have the horsepower and synchronization necessary to support RF SiP/SoC testing. Expanding the density of these instruments is making it easier to test multiple devices or SiPs, in parallel, on a single tester. This multisite aspect of RF SoC testing is reducing the cost of testing these high demand devices.