The Package Becomes the System

Abstract

The benefits of system miniaturization lower-cost, higher electrical performance and better thermal mechanical reliability, than the current approach of discrete component packaging have been discussed at length. Several technologies have been used to address these benefits. SOC, SiP, Fan-In and Fan Out and wafer level packages. Recently there has been much discussion about Fan Out Wafer Level packaging (FOWLP) to integrate the entire system in package. However, actual implementations fall short of a complete system in a package in that only few of the chips and some passives are currently integrated into the FOWLP. But what about the rest of the system? A true system also requires additional components not traditionally considered integrate-able into a package. These include antennas, batteries, thermal structures, RF, Optical, micro-electromechanical systems (MEMs), and micro sensor functions. The current FOWLP package technology as discussed by the media falls short of this type of system integration due to limitations in the number of chips that can be integrated and the lack of sufficient interconnect layers to support these functions in a system. 3D stacking has also been employed to improve the SiP by adding memory components. These implementations are limited to stacking of identical chips with through hole silicon vias (TSV) located remotely from any circuitry. Aurora Semiconductor will introduce a packaging technology where the package becomes the system. We call this technology 4DHSiP™ or 4D Heterogeneous System in package. 4DHSiP™ is a system miniaturization technology in contrast to system on chip (SOC) at the integrated circuit level and system in package stacked ICs and packages (SIP) at the module level. 4DHSiP™ is considered an inclusive system technology in which, SIP, thermal structures and batteries are considered as substantive technologies. 3D stacking is no longer limited by the location of the TSV within the stacked components. Heterogeneous multi-chip sub module layers can be stacked to accommodate additional system components. These layers, when interconnected, form the entire system. By stacking sub module layers, specific component types can be located on the top most layer as needed by specific function (e.g. Bio functions, Optical functions, Antennas). An example of this type of module stacking used to create an optical based system will be shown.4DHSiP™ is a new, emerging system concept where the device, package, and system board are miniaturized into a single system package including all the needed system functions. Such a single system package with multiple heterogeneous ICs provides all the system functions by co-design and fabrication of digital, radiofrequency (RF), optical, micro-electromechanical systems (MEMS) in either the IC or the system package. 4DHSiP™ combines the best on chip and off chip integration technologies to develop ultra-miniaturized, high-performance, multifunctional products. A significant benefit of this miniaturization is the elimination of multiple sockets and connectors currently used to connect sub-systems together. This ultra-miniaturization of multiple to mega functions, ultrahigh performance, low cost and high reliability will be the way systems are designed in the future to achieve More than Moore.