Abstract
Experiments are carried out to measure the volume shrinkage during solid-state reaction in micro-joints for three-dimensional integrated circuit applications. Surface profilometer is employed to measure the volume shrinkage for the reaction between Ni and Sn. The shrinkage is correlated with the microstructural evolution during the reaction. It is found that the volume shrinkage is released through both joint height reduction and void formation. The resulting internal stress and the void formation might post potential reliability issues.
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