Abstract
The volume shrinkage during the solid-state reaction in Ag-doped Sn micro-joints for three-dimensional integrated-circuit applications is measured. It is found that more than 94% of the volume shrinkage is accommodated by height reduction of the micro-joints. This observation is in sharp contrast to results of a previous study in which no Ag was added, and the volume shrinkage occurred through both height reduction and void formation. A mechanism that accounts for this difference is proposed.
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