Abstract
Water-based immersion lithography has been introduced for achieving O(10 nm) spatial resolution in the semiconductor industry. The major challenges remaining in immersion lithography are to decrease the tail of the main lens and to prevent residual droplet formation after the main lens while increasing the relative speed of the silicon wafer with respect to the main lens. Here, we propose a novel method to control the shape of the immersion lens by applying Marangoni stress using volatile vapor. Furthermore, we experimentally and theoretically observed that the stability and wafer speed of the immersion lens are increased by the vapor-driven solutal Marangoni effect.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
