Abstract
In recent years, several new methods for IC-level electromagnetic compatibility (EMC) testing have been introduced. Therefore, a handy vehicle for IC-EMC testing is required to validate the effectiveness of the new IC-EMC testing methods. This paper proposes an 8051 MCU for IC-EMC testing platform with in-system programming (ISP) and decoupling capacitor (decap) functions. In order to reduce the EMI and improve the EMC properties for the 8051 MCU, decoupling capacitors (decaps) are added to the integrated circuit (IC) design flow. Chip-level design and fabrication technology are fundamental and cost-effective solutions to this issue. A cell-based design flow is used for chip implementation; specifically, TSMC 90-nm technology is used to implement the present chip via the National Chip Implementation Center. This study will implement two 8051 MCU chips: one that internally comprises a large number of decaps, and another that comprises no decaps. We also implemented an IC-EMC testing platform composed of a multifunction test board and several off-board probes that were fabricated according to IEC 61967 and IEC 62132 standards. The platform demonstrates a method for using the proposed two 8051 chips in EMC testing, and we reveal the results of its EMC performance. Finally, this study simulates the EMC properties, compares the two 8051 MCU chips, conducts static or dynamic analyses for the chips in a power network, and measures the EMC improvements.
Highlights
The ease-of-use, wide applicability, and high reliability of 8051 microcontroller units (MCUs) has led to their wide-scale application in embedded systems
This study developed a new 8051 MCU comprising an MC8051 core and in-system programming (ISP) [2] mechanism
In the process of automatic placement and routing (APR), a filler cell with the decap function is added to the 8051 MCU chip to improve its electromagnetic compatibility (EMC) properties
Summary
The ease-of-use, wide applicability, and high reliability of 8051 microcontroller units (MCUs) has led to their wide-scale application in embedded systems. An in-system programming (ISP) architecture can shorten the lead time and reduce costs [3]. When the power supply voltage drops too low, circuit functionality and performance can be compromised [5]. The decoupling capacitor (decap) function is widely used to overcome power supply noises. Decaps may be temporarily regarded as power supply sources that reduce the noise peaks of noise voltages in the frequency domain. Decaps are expected to offer good IC-EMC solutions that can stabilize the power supply and reduce the high-frequency noises in a power distribution network (PDN). The ISP structure implements online programming, and the serial transmission interface reduces the number of I/O pads, and the area of the 8051 MCU. The researchers build an 8051 MCU chip with ISP and decap functions by using TSMC 90-nm technology through the CIC. The TSMC SRAM uses a special process and has better area and speed efficiency, allowing improvements in overall performance for the 8051
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