Abstract
This work presents direct measurements of stress and temperature distribution during the mesoscale microstructural deformation of Inconel-617 (IN-617) during 3-point bending tests as a function of temperature. A novel nanomechanical Raman spectroscopy (NMRS)-based measurement platform was designed for simultaneous in situ temperature and stress mapping as a function of microstructure during deformation. The temperature distribution was found to be directly correlated to stress distribution for the analyzed microstructures. Stress concentration locations are shown to be directly related to higher heat conduction and result in microstructural hot spots with significant local temperature variation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
