Abstract
The article is devoted to the problems of protection of on-board electronic equipment (BEA) from vibration effects. To ensure BEA protection, it is necessary to know the characteristics and conditions of external influences and, in accordance with this, choose a method to reduce their influence on the BEA performance. The article discusses the most common ways to reduce the impact of mechanical external influences, and also provides analytical calculations of the printed circuit board and their correlation with the results of mathematical modeling. The developed technique for modeling vibration effects on the printed circuit assembly allows you to more effectively evaluate the physical characteristics of the product, thereby avoiding design errors and inaccuracies.
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