Abstract

This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental modal analysis and FE model validation with the help of modal analysis is presented in this paper. In contrast to previous studies, this study is focused on stress analysis of orthogonal and diagonal arrangement of CSPs on PCB and provides stress distribution for both. Stress distribution identifies the location of the critical solder joint and confirms that corner solder joint experiences highest stress levels as compared to other solder joints and are more prone to failure due to crack formation. Along with harmonic vibration loads, PCB assembly and FE model was also investigated under the influence of random vibration loads. Simulation results show a good correlation with experimental results and confirm that finite element method is a valid support for vibration analysis of electronic boards.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.