Abstract
Vibration analysis of low temperature BGA and LGA solder joints at elevated test temperatures
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
https://doi.org/10.1016/j.microrel.2024.115586
Journal: Microelectronics Reliability | Publication Date: Feb 1, 2025 |
Vibration analysis of low temperature BGA and LGA solder joints at elevated test temperatures
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.