Abstract
A novel method of forming vias and embedded resistors in a double-sided electronic circuit substrate is proposed. The structures are formed by removing conductive material from a target by laser ablation and depositing it into a hole previously drilled in the substrate. The target is composed of a matrix material, which is readily ablated, supporting conductive particles that are ejected along with the matrix material to be re-deposited on the sides of the hole. The nature of the conductive particles determines whether a via or a resistor is formed.
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