Abstract
A process for the fabrication of vertical gate-all-around (GAA) nanowire p-FETs with diameters of down to 20 nm based on Ge and GeSn/Ge-heterostructures is presented. The resulting Ge-based devices exhibit a low subthreshold slope (SS) of 66 mV/dec, a low drain-induced barrier lowering of 35 mV/V and an I on/I off-ratio of 2.1×106 for devices with a diameter of 20 nm. Using a GeSn/Ge-heterostructure with GeSn as the top layer and source of the device, the on-current was increased by ~32%. With these results the high potential of incorporation of GeSn into Ge-MOSFET technology is demonstrated.
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