Abstract
A variation in microstructure and mechanical property (microhardness) was observed across the Cu/Sn/Ni solder joint. The microhardness of the Sn solder joint monotonically decreases away from the Cu side toward the Ni side. A coarser shear band occurred in the indentation marks of the solder matrix near the Ni side. The above findings imply that the solder matrix with a hypoeutectic microstructure near the Ni side has lower mechanical strength. The hypereutectic microstructure near the Cu side has higher mechanical strength.
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