Abstract
Vapor phase cooling of semiconductor circuit components using a sealed heat exchanger with natural convection to air can be an effective static method of heat removal. The salient characteristic of heat transport through the flow of vapor can be combined with the capability of "spreading" waste heat energy uniformly within a compact condenser of large surface area. An additional capability, exists for locating the condenser in a position which is thermally remote from the circuit arrangement. A heat exchanger designed to exploit these features can result in a more compact equipment arrangement, and one which will dissipate heat energy at a lower overall thermal resistance than is possible with conventional static cooling systems.
Published Version
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