Abstract

A gate-all-around (GAA) field effect transistor with vacuum gate dielectric is presented as a structure free from hot-carrier injection and bias temperature instability. A conventional GAA fabrication process is used along with selective removal of the sacrificial gate oxide as an extra process step. The lowered dielectric constant in vacuum gate dielectric can be compensated by the nature of the nanowire and physical oxide thickness reduction. As the nanowire channel is fully surrounded by empty space, reliability issues relevant to the gate dielectric can be completely cleared.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.