Abstract
Copper deposition on various substrates (ceramics, quartz, polymide) by excimer laser-induced decomposition of adsorbed copper acetylacetonate films was investigated. Electroless copper and nickel plating was used for enhancement of the selective laser-induced copper pattern. The combination of laser structuring with commercial electroless metal deposition is an interesting approach in producing circuit pattern and interconnects for application in hybrid technologies.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
