Abstract
A study was made of the processes of electroless plating of alumina powders with nickel and copper. Electroless nickel and copper plating with full pretreatment was performed at room temperature. In nickel plating by the process investigated the number of pretreatment operations can be reduced by raising the solution temperature to 50–55°C, although nickel plating with full pretreatment is to be preferred from a practical point of view. The concentrated solutions investigated are suitable for the application of nickel and copper layers of considerable thickness to alumina powder particles.
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