Abstract
This paper reports on a newly developed anti-sticking resin obtained by mixing a fluorine-containing monomer (F-monomer) for UV nanoimprinting lithography (UV-NIL) to reduce the contact adhesion force during the demolding process. The new resin system shows an enhanced reliability and resolution of pattern transfer with no treatment on the surface of the quartz stamp. We fabricated various nanopatterns with F-monomer resins of various concentrations in the low pressure UV-NIL. The number of process steps of a release layer treatment for UV-NIL was reduced by using F-monomer with anti-sticking property.
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