Abstract
Multichip modules (MCMs) are increasingly used for high frequency, microwave, and millimeter wave applications. This has prompted the need for low loss dielectrics to meet the performance requirements of multilayer interconnects used in MCMs. In the GE high density interconnect (HDI) process, adhesives are used to bond dielectric film layers over bare chips and components. After vias are formed in the dielectric and adhesive, patterned metal is fabricated, and additional layers of dielectric are bonded and additional patterned metal is fabricated to complete the interconnect structure. In this study, we evaluated the electrical performance of selected adhesives used to bond one dielectric film layer to another. The use of a low loss thermoset polymer such as benzocyclobutene (BCB) as the adhesive resulted in lower dielectric losses compared to an epoxy-based adhesive evaluated over the 10-20 GHz regime tested. Based on the experimental data derived in this study, the electrical performance improvement should be even more significant at higher frequencies.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.