Abstract
The thermal cycling reliability of ceramic/metal laminates is critical for their applications in microelectronic modules. A eutectic bonding process is used to prepare copper/sapphire bilayers in this study. Due to elastic and thermal mismatches between alumina and copper, the Cu/sapphire bilayer cannot pass a thermal cycling test. The thermal cycling reliability can be improved through the use of a metallic nickel interlayer. During the bonding process, the nickel interlayer was oxidized first, reacted with alumina to form a NiAl2O4 spinel phase. The thermal diffusivity of the bilayer with spinel interphase remains high after the temperature cycling test.
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