Abstract
ABSTRACT In this study, we investigated the microstructural evolution of a Cu-0.13Sn-0.04Mg alloy that underwent heat treatment followed by room temperature rolling (RTR). Initially heat-treated specimens were rolled at room temperature (RT) with reduction ratios (RR) of 40% and 75% to perform microstructural and crystallographic textural analyses. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) were utilise to examine both initial and deformed microstructures. Both exhibited heterogeneous microstructural distributions. Shear bands (SBs) existed in the initial specimen and became main sites for the nucleation of new grains during heat treatment. A denser presence of SBs was noted in the RTR specimens. Remarkably, an unusual self-annealing phenomenon was observed in these specimens, culminating in the emergence of recrystallized grains at RT. A plethora of such grains was observed in the severely deformed specimens, with numerous nucleating grains appearing proximal to the SBs or deformed grain boundaries (GBs). Time dependent microstructure evolution was observed via ex-situ EBSD technique in the compressed specimens. Formation of new grains, increase in high angle grain boundaries (HAGBs), and dislocation annihilations were observed with the progress of time. The crystallographic texture evolution in the initial specimen was predominantly influenced by the S component. At lower strains, the fractions of Copper component increased, whereas at higher strains, a greater fraction of Brass and S components were induced. Following a 40% RR, a saturation in hardness value was observed, which could be potentially attributable to an accelerated rate of RT recrystallization in the case of 75% RR.
Published Version
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