Abstract
Align Industry around an open platform to enable chiplet based solutions. Enables construction of SoCs that exceed maximum reticle size -Package becomes new System-on-a-Chip (SoC) with same dies (Scale Up) -Reduces time-to-solution (e.g., enables die reuse) -Lowers portfolio cost (product & project) -Enables optimal process technologies -Smaller (better yield) -Reduces IP porting costs -Lowers product SKU cost -Enables a customizable, standard-based product for specific use cases (bespoke solutions) -Scales innovation (manufacturing and process locked IPs)
Full Text
Published Version (
Free)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call