Understanding the role of surface mechanical properties in SiC surface machining

Abstract

Surface modification layers play a crucial role in enhancing machinability during reaction-assisted machining due to the interrelated behavior of the surface and interface resulting from their structure-properties relationship. However, determining the impact of surface mechanical properties on a coherent interface through experiments is challenging. To overcome this limitation, atomistic simulations were performed, which involved constructing coherent interfaces with varying mechanical properties by adjusting the Tersoff-style potential function. The 4H–SiC machining example involved introducing soft, pristine, and modification layers. The findings indicated that the soft layer acted as a buffer, reducing substrate stress, while the modification layer enhanced efficiency at greater penetration depths, and near-interface dynamic behaviors were altered. Additionally, it was indirectly suggested that the effect of a harder modification layer on the interface may be more significant than the difference in mechanical properties between the modification layer and substrate.