Abstract
Two parallel plates with a dimension of 5mm×5mm and various gap heights (5, 10, 15, 20, 25, 30, and 35μm) are simulated using a finite volume method-based software. A three-dimensional model is constructed, and a non-Newtonian underfill flow is simulated using computational fluid dynamics. The flow front advancement is monitored using the volume of fluid model. The underfill process for the two parallel plates and effect of gap height are the main focuses, and the application of flip chip packaging with a gap height of 30μm is studied. The gap height has a crucial influence on the filling time and pressure drop. The presence of solder bumps is found to have a significant effect on the flow pattern at the melt flow portion. The comparison of the simulation and analytical results are in good conformity for the underfill flow of the two parallel plates.
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