Abstract
A bonded crack model method is presented for estimation of the stress intensity factor (SIF) for a 3D half-penny shaped crack originating at a bonded interface subjected to remote constant tensile and proportional bending loadings. Closed-form approximations are obtained for the SIF as a function of modulus ratio of bonded dissimilar materials. A combination of bonded crack model method and macro-level stress calculations in a structure without a crack (uncracked body analysis) significantly simplifies accurate estimation of SIF. The method was validated using 3D finite element computations. Since the proposed method requires no repetitive stress calculation as crack size changes, it is useful in life predictions.
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