Abstract
Interface cracks seriously affect the performance and service life of layered electronic devices. At nanoscale, the electric field concentration can be generated at the tip of insulating cracks by solely applying a uniform electric field loading, resulting in a large electric field gradient and thus inducing a significant converse flexoelectric effect. The deformation generated by the converse flexoelectric effect is expected to achieve crack shielding, however, its mechanism is still not clear. In this paper, the role of electric field gradients on interface crack behavior is studied by the collocation mixed finite element method (MFEM) and the J-integral. The result shows that the electric field gradient generated by a uniform electric displacement loading can reduce the J-integral of crack tips, achieving crack shielding. The result provides new ideas for the study of failure assessment, nanoscale fracture experiment and others.
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