Abstract

ABSTRACTPlasma immersion ion implantation (PIII) has been employed to controllably place nitrogen ions from an inductively coupled plasma into a thin furnace grown gate oxide 2.0nm thick with implant voltages from 25 to 500V. Control of the implant energy enables shallow implantation confining the nitrogen mainly within the oxide. Rapid thermal annealing is essential in repairing any damage to the implanted silicon dioxide and silicon while consolidating the bonding of nitrogen into the oxide film prior to gate polysilicon deposition. High frequency capacitance-voltage measurements of capacitors made with BF2+ implanted gates throughout a series of furnace anneals demonstrates the efficiency for blocking boron compared to non-nitrided oxides of similar thickness. Tddb measurements verify excellent reliability compared to a non-implanted oxide for both stress polarities.

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