Abstract
Flip chip technology has been rapidly developed and widely used in the field of microelectronic packaging, and defect detection has received increasing attention. The ultrasonic detection method is used to detect the defect information of the packaged chip. However, the ultrasonic signal obtained during the detection process is disturbed by noise, which seriously affects the true information of the defect signal. For this problem, the matching matching pursuit (SMP) algorithm is used in combination with Gabor. The atomic library realizes adaptive matching of noisy ultrasonic signals. The linear combination of selected atoms is used to represent the denoised signals to achieve the denoising effect of noisy ultrasonic signals. The denoising effect of the SMP algorithm in the experiment is compared with the MP algorithm, and the results show that the denoising effect of the SMP algorithm is better.
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