Ultrashallow depth profiling using SIMS and ion scattering spectroscopy

Abstract

AbstractThe accuracy of ultrashallow depth profiling was studied by secondary ion mass spectrometry (SIMS) and high‐resolution Rutherford backscattering spectroscopy (HRBS) to obtain reliable depth profiles of ultrathin gate dielectrics and ultrashallow dopant profiles, and to provide important information for the modeling and process control of advanced complimentary metal‐oxide semiconductor (CMOS) design. An ultrathin Si3N4/SiO2 stacked layer (2.5 nm) and ultrashallow arsenic implantation distributions (3 keV, 1 × 1015 cm−2) were used to explore the accuracy of near‐surface depth profiles measured by low‐energy O2+ and Cs+ bombardment (0.25 and 0.5 keV) at oblique incidence. The SIMS depth profiles were compared with those by HRBS. Comparison between HRBS and SIMS nitrogen profiles in the stacked layer suggested that SIMS depth profiling with O2+ at low energy (0.25 keV) and an impact angle of 78° provides accurate profiles. For the As+‐implanted Si, the HRBS depth profiles clearly showed redistribution in the near‐surface region. In contrast, those by the conventional SIMS measurement using Cs+ primary ions at oblique incidence were distorted at depths less than 5 nm. The distortion resulted from a long transient caused by the native oxide. To reduce the transient behavior and to obtain more accurate depth profiles in the near‐surface region, the use of O2+ primary ions was found to be effective, and 0.25 keV O2+ at normal incidence provided a more reliable result than Cs+ in the near‐surface region. Copyright © 2007 John Wiley & Sons, Ltd.