Abstract
We have demonstrated a high-density wiring interposer for 10 GHz 3D LSI packaging using a photosensitive multiblock copolymerized polyimide. We confirmed experimentally that the high-density wiring interposer could be fabricated using the polyimide and the gold metal. From the time domain reflectometry (TDR) measurement using a specially prepared 20-µm-pitch microwave contact probe, the characteristic impedance of a 12.5-µm-wide 12.4-mm-long strip-line was determined to be within 55.2 Ω ± 11.5 % at the central 10-mm-square area of the interposer. From the highresolution time domain transmission (TDT) measurement, the insertion loss (S-parameter: S21) of -5.5 dB at 10 GHz was calculated through the strip-line. Finally, we confirmed eye diagram measurement at 10 Gbps through the strip-line on the fabricated interposer. The aperture size of the measured eye diagram at 5 Gbps was sufficiently for signal propagation.
Published Version
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