Ultrafast laser micromachining of 3C-SiC thin films for MEMS device fabrication

Abstract

Femtosecond pulsed laser (800 nm, 120 fs) micromachining of thin films of 3C-SiC (β-SiC) semiconductor deposited on silicon substrate was investigated as a function of pulse energy (0.5 μJ to 750 μJ). The purpose is to establish suitable laser parametric regime for the fabrication of high accuracy, high spatial resolution and thin diaphragms for high-temperature MEMS pressure sensor applications. Etch rate, ablation threshold and quality of micromachined features were evaluated. The governing ablation mechanisms, such as thermal vaporization, phase explosion, Coulomb explosion and photomechanical fragmentation, were correlated with the effects of pulse energy. The results show that the etch rate is higher and the ablation threshold is lower than those obtained with nanosecond pulsed excimer laser ablation, suggesting femtosecond laser’s potential for rapid manufacturing. In addition, the etch rates were substantially higher than those achievable in various reactive ion and electrochemical etching methods. Excellent quality of machined features with little collateral thermal damage was obtained in the pulse energy range (1–10 μJ). The leading material removal mechanisms under these conditions were photomechanical fragmentation, ultrafast melting and vaporization. At very low pulse energies (<1 μJ), nanoscale material removal has occurred with the formation of nanoparticles that is attributed to Coulomb explosion mechanism. The effect of assist gas on the process performance at low and high energy fluences is also presented.