Abstract
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Highlights
Most electronic equipments tends to be thinner and lighter, so heat pipe, which is used in thermal solution to cool down heat source such as semiconductor device, needs to be thinner and lighter too
The maximum heat transfer rate is restricted by liquid flow pressure drop
From what has been discussed above, we can conclude that ultra thin heat pipe can be applied to various thermal solutions, such as remote heat sink and heat spreader, etc., which is demanded to be thin for mounting to electronic equipments
Summary
Most electronic equipments tends to be thinner and lighter, so heat pipe, which is used in thermal solution to cool down heat source such as semiconductor device, needs to be thinner and lighter too. Heat pipe has unfavorable feature that thermal performance becomes worse when heat pipe is flattened. When heat pipe is flattened, pressure drop originated in vapor and liquid flow are increased remarkably because of narrow space for vapor and liquid flow. Heat pipe does not work when inner pressure drop cross over capillary force of wick structure. In order to realize heat pipe which has both thin thickness and high performance, optimization of inner structure is needed. The maximum heat transfer rate of conventional groove heat pipe is shown in hutched area. When heat pipe thickness is 2mm or less than, the maximum heat transfer rate drops to almost zero. We have developed the ultra thin heat pipe, shown by dotted area in Fig.[1], which has high maximum heat transfer rate
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