Ultra High Density Capacitors merged with Through Silicon Vias to enhance performances.

Abstract

IPDIA presents itself as the 3D Silicon leader providing innovative platforms for customers who want to demonstrate technological concepts based on Through Silicon Vias. The market segments Medical, Lighting, and Industrial addressed by the Ipdia Technology are adopting 2.5-D and 3-D technologies to increase the performance and density of their devices through the use of silicon interposers and through-silicon vias (TSVs). The via last approach developed by IPDIA allows large possibility of integration combining TSV with active or passive devices such as High-density trench capacitors, MIM capacitors, Resistors, High-Q inductors or Zener diodes . The purpose of this paper is to focus on through-silicon via (TSV) combined with IPD , providing an interposer which could have two surfaces with devices. Emphasis is placed on 3D trench capacitor technology with an update of the roadmap .Examples of applications using chip-to-chip interconnections through a passive TSV interposer in a 3D IC integration system-in-package (SiP) are briefly presented. Some important results and recommendations are summarized: the process steps for passive devices interposer /TSV/redistribution layer (RDL)/microbumps /, the design rules .A comparison between TSV on active chips and passive interposer with TSV will be detailed.