Abstract
A method for making thin copper foil attached carrier was developed without additional release layer on carrier in this study. The carrier copper foil was two-layered structure, carrier and copper foil, which was different from the traditional three-layered. Copper is directly electrodeposited on certain carriers which have spontaneous and conductive oxides formed on surface. The oxides will be utilized as a release layer. The two-layer structured carrier copper foil showed releasable capability after annealed at 400°C for 2 hours. The high temperature release performance of the interface was also studied for making 2L-FCCL by PI casting process. It showed that the interface was releasable and the release peel strength was averagely less than 40gf/cm after PI casting process with at least 1hour of curing at temperature higher than 360°C. Moreover, the etching residues were identified with EDX mapping and no copper component was found at the space area.
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