Abstract
The aim of this study is to introduce the development and application of the ultra copper foil of Nan Ya Plastics Corp. The structure of the NY ultra thin copper foil comprising three parts, that is (1) the supporting foil (2) the release layer and (3) the thin copper foil. The key component of this foil is the release layer which is the four element alloy. It provides a uniform bonding strength which is adequate to prevent separation of the supporting foil and ultra-thin copper foil during handling and lamination. Owing to the low surface roughness and thin thickness, the NY ultra thin foil exhibit the excellent etching performance. Therefore, it especially suitable to apply in the fine circuit pattern application, such as IC substrate. According to the experimental results, the 30μ m line width and 30 μ m line spacing pattern can be achieved by using the ultra thin foil.
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