Abstract

Gold and tungsten were deposited on silicon wafer and/or glass substrates by using random incidence sputtering deposition and thermal vapor deposition techniques. Two-dimensional tungsten nanotriangle and gold nanoring arrays were obtained on the silicon wafer substrate and examined using scanning electron microscope and atomic force microscope analysis. The size of the equal tungsten nanotriangles is within 100 nm per side and 210 nm apart from each other. The size of gold nanorings is 220 nm diameter, 40 nm wide, 10 nm thick, and 560 nm apart from each other. No nanorings were found on the glass substrate. Mechanisms for the formation of nanoring arrays are discussed.

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