Abstract
The high-temperature short-time heating step was followed by the low-temperature isothermal solidification step to join IN-738LC superalloy. The shorter bonding time can be applied in comparison to the conventional transient liquid phase process. A dendritic-cell like initial interface was observed which is different from a planar interface of conventional TLP bonds. This led to non-uniform distribution of voids along the joint. By completion of the isothermal solidification, quantity and size of the voids were decreased. A homogenization heat treatment produced the microstructure similar to that of the base metal.
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