Two-Stage Tunneling-Dominated Electrodeposition for Large-Scale Production of Ultralong Wavy Metal Microstructures on Native Oxide Layer-Passivated Si Electrode with Specific Surface Configuration

Abstract

Wavy-shaped metallic materials play a significant role in various applications. The current synthesis strategy for such materials is limited to top-down thin metal film etching. Note that top-down etching is inevitable to process more surface dangling bonds than their bottom-up analogues and results in poor chemical stability. However, up to now, no bottom-up method has been presented to produce wavy-shaped metallic materials. Here, taking Cu as a model material, a bottom-up two-stage tunneling-dominated electrodeposition strategy is reported to produce ultralong Cu wavy microstructures (WMSs) on a lithographically patterned and native oxide layer-passivated Si electrode, where direct electron transfer is impeded. Scanning electron microscopy and field-emission scanning electron microscopy results demonstrate the large-scale production of Cu WMSs consisting of interconnected octahedral and cuboctahedral nanoparticles. The I–V curve suggests good electrical performance of the as-deposited Cu WMSs. Together...