Abstract
Two‐layer wirings with a total thickness of only 15 μm could be prepared by chemically metalizing a 5 m Mylar foil, electrodeposition of copper and photoetching. It was possible to produce plates of the outer dimensions . Resistances of the metal lines (100 µm width and 5 µm thickness) were equal to within ±5% of an average value. Matrices of this sort may be used for various purposes, e.g., as drive line systems for low‐current plane magnetic film memories.
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