Abstract
In this paper, we propose two different types of multisensor fabricated by various manufacturing methods. The first type of multisensor is fabricated all on the same chip. This type of the multi-sensor consists of three different sensors, a piezoresistive sensor, a capacitive proximity sensor, and a photodiode sensor for system units consisting of two different sensors, a capacitive proximity sensor and a photodiode sensor for mobile applications. The second type of multisensory, which is responsible for each function, is combined with a sandwich structure. This type of the multisensor consists of three different sensors: a piezoresistive sensor, a tilt sensor, and a photodiode sensor. The various components of the multisensor can perceive different types of external tamper independently, resulting in more reliable responses. The multisensor could be applied to detect external tampering on various types of system unit.
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