Abstract

Accurate modeling of threshold voltage is necessary in the integrated circuit design of strained silicon devices. Thoroughly researching the factors that affect threshold voltage and establishing a more precise threshold voltage model, can provide essential theoretical support for integrated circuit design. By solving a Poisson equation, in this paper, we demonstrate a comprehensive physical model for the threshold voltage of strained Si NMOSFETs using the gradual channel approximation theory and a quasi-two-dimensional analysis. The model investigates the physical effects such as short-channel, narrow-channel, non-uniform doping, and drain-induced barrier lowering effects on the threshold voltage. After substituting the extracted parameters into the model, a comparison was made with experimental results to validate the accuracy and correctness of the established model. Additionally, variations in the tunneling current of small-sized devices were studied. The two models provide essential references for the analysis and design of strained Si large-scale integrated circuits.

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