Tunneling current through non-alloyed metal/heavily-doped SiC interfaces

Abstract

In this paper, tunneling phenomena at metal/heavily-doped SiC Schottky (non-sintered) interfaces are reviewed, and a design guideline for low-resistance non-alloyed SiC ohmic contacts is proposed. Carrier transport at Schottky contacts on heavily-doped SiC epitaxial layers is quantitatively described by direct tunneling (DT) including both of the thermionic field emission (TFE) and field emission (FE) when the doping density (Nd) is higher than mid-1017cm−3. As for p-type SiC, tunneling of holes in the split-off band is the dominant conduction mechanism due to its light effective mass (0.21m0). Phosphorus ion (P+) implantation makes the interface tunneling current larger by several orders of magnitude compared with that at contacts on epitaxial layers with almost the same Nd, which is plausibly explained by trap-assisted tunneling (TAT) through implantation-induced defect levels. The contact resistivity (ρc) at non-alloyed ohmic contacts formed on heavily P+-implanted SiC (Nd>4×1018cm−3) is significantly reduced thanks to the contribution of TAT especially when Nd is lower than about 1020cm−3, while ρc decreases with increasing Nd according to the DT theory in a higher Nd range (>1020cm−3). At a very high Nd of 2×1020cm−3, an extremely low ρc of 1–2×10−7Ωcm2 is demonstrated for non-alloyed Mg and Ti contacts. Through the experiment and calculation of tunneling current, a model to predict ρc at non-alloyed ohmic contacts taking account of the contributions of TAT and DT is proposed, and a design guideline for low-resistance non-alloyed ohmic contacts is presented as follows; a very low ρc (<10−6Ωcm2) is achievable without sintering by lowering the interface barrier height (≤1eV) and utilizing high-dose ion implantation (≥3×1019cm−3).