Abstract

Tunnel field-effect transistors (TFETs) as low voltage device options have attracted recent attention for energy efficient circuit designs with CMOS technology scaling. This paper presents the circuit and architectural co-design approach for designing reliable and energy efficient architectures (adder cells) for new computing platforms at supply voltages. At circuit level TFET-based 28-transistor static logic design (28T) and 24-transistor transmission gate logic design (24T) have been explored. At architectural level, multiplexer (MUX)-based 22-transistor full adder design (22T) is proposed. Performance of TFET-based architectures have also been benchmarked with 20[Formula: see text]nm double gate Si FinFET technology. It has been seen that with FinFET technology 24T design is not effective in terms of energy efficiency and reliability (due to the large leakage currents in transmission gate logic topology). 28T design is the best in reliability perspective (in terms of reduced over shoots, full logic swing and reduced glitch duration etc.) and 22T design to be energy efficient option. It has been demonstrated in this paper that TFET’s steep slope characteristics enable the 24T design to have similar reliability characteristics like 28T design and energy efficiency like 22T design. TFET-based 22T design has [Formula: see text]91% smaller energy delay product (EDP) and [Formula: see text]84.4% less power delay product (PDP) in comparison to the low threshold voltage (LVT) FinFET 22T design at 0.2[Formula: see text]V VDD.

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