Abstract
Robust power delivery is one of the ITRS scaling grand challenges due to increasing operating frequencies, increasing power density, and decreasing supply voltages. Three dimensional stacking of multiple dies makes this problem even more challenging. In a 3-D IC, only the die adjacent to the package can get power directly from the package. Dies away from the package require new technologies for power delivery. We evaluate in this chapter using TSVs to deliver power in a 3-D IC with the goal of understanding factors that contribute to the performance of a 3-D power delivery network (PDN). We investigate the impact of TSV size. We study various architectural configurations to find the best TSV granularity. We explore the impact of shared and dedicated TSVs on PDN performance and the feasibility of coaxial TSVs for power delivery.KeywordsPower GridFunctional BlockSilicon AreaPower DeliveryVoltage DroopThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
