Abstract
This paper proposes the evaluation method of fatigue damage (fatigue crack length) in solder joints of electronic devices. The fatigue damage is evaluated by means of the residual strength obtained by the peeling test of cracked solder joint after mechanical fatigue test. The observation of fracture surface of solder joints are carried out by scanning electron microscope (SEM) in order to investigate the relationship between the residual strength and fatigue crack length. Moreover, the residual strength of cracked solder joints is estimated by the finite element analysis. The test and analysis are carried out for the surface mount IC packages. It is found that the fatigue damage in solder joints can be evaluated by the peeling test and the finite element analysis is available for the estimation of the residual strength.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
