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Abstract
We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Significant differences in real-time shear force and coefficient of friction data from the wafer-solution-brush interface (both in time domain as well as frequency domain) have been attributed to differences in each supramolecule’s chemical functionality and structure, which in turn, have been correlated to wafer-level defects. The work has underscored the importance of measuring the tribological attributes of post-CMP cleaning processes in an effort to improve cleaning performance.
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