Abstract
In this study, the impact of aluminum ion implantation on 1/f noise characteristics and random telegraph noise (RTN) in high-k/metal gate (HK/MG) p-type metal–oxide–semiconductor field-effect transistors (pMOSFETs) was investigated. Aluminum ion implantation (Al I/I) into TiN/HfO2/SiO2 was implemented to tune an effective work function (EWF) in pMOSFETs without EOT increase complicated processes. RTN and 1/f results revealed that regardless of the implanted dose, HK/MG devices with Al I/I exhibit lower slow oxide trap densities than the control devices, which are responsible for the reduced trap position (xt) from the SiO2 interfacial layer (IL)/Si interface. For the HK/MG devices with different implanted doses, no significant differences in trap properties were observed.
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