Abstract

This work numerically elucidates the effects of transverse scaling on Schottky barrier charge-trapping cells for energy-efficient applications. Together with the scaled gate structures and charge-trapping dielectrics, variations in bias conditions on source-side injection are considered for properly operating Schottky barrier cells in low-power or high-efficiency applications. A gate voltage of 5 to 9 V with a drain voltage of 1 to 3 V was employed to program the Schottky barrier cells. Both the non-planar double-gate gate structure and scaled dielectric layers effectively improve the source-side programming. When the gate voltage of 5 V was operated, there were roughly two orders of magnitude greater injected gate currents observed in the ONO-scaled double-gate cells. Five successive programming-trapping iterations were employed to consider the coupling of trapped charges and Schottky barriers, examining the differences in physical mechanisms between different design options. The gate structures, dielectric layers, and gate/drain voltages are key factors in designing transverse scaled Schottky barrier charge-trapping cells for low-power and high-efficiency applications.

Highlights

  • Nonvolatile flash memory has become one of the mainstream memories in the semiconductor industry because of the rapid growth of demands for portable and automobile electronics [1,2,3]

  • Innovative source-side injection Schottky barrier cells eliminate the tradeoffs to provide a promising candidate for energy-efficient applications [9,10,11,12,13,14]

  • It implies that when the gate voltages are sufficiently high to secure low-resistance Schottky tunnel barriers, the source-side lateral electric field reaches its maximum value to result in a similar injection efficiency

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Summary

Introduction

Nonvolatile flash memory has become one of the mainstream memories in the semiconductor industry because of the rapid growth of demands for portable and automobile electronics [1,2,3]. The non-planar double-gate architecture and scaled high-k materials were fulfilled using CMOS FinFETs technology, while practical knowledge of applying them to Schottky barrier cells for energy-efficient memories remains inadequate [19,20]. This work elucidates the effects of scaling transverse gate structures and dielectric layers on source-side injection Schottky barrier charge-trapping cells. Comparisons of cell characteristics were made between the low-power and high-efficiency design options

Device Structures and Numerical Parameters
Drain and Gate Currents
Source-Side Injection
Drain Voltage
Gate Voltage
Successive Injection-Trapping Iterations
Scaled Double-Gate and Non-Scaled Single-Gate Cells
Low-Power and High-Efficiency Cells
Conclusions
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